Capabilities
Electron Beam
This process achieves very high deposition rates. Additionally, the material utilization efficiency is good relative to the other methods.
Ion Plating
In this technique, the substrate is electrically biased, which can increase coating adhesion to the substrate. As a result, it allows us to tailor the physical and electrical characteristics of the coating deposit. In addition, this process allows for better surface coverage.
Sputtering
This method produces a precisely controllable stream of coating atoms. In addition, these atoms exhibit high adhesion to substrates. Furthermore, VPE has control over the growth as well as the microstructure of the film.
Reactive Sputtering
This process controls ambient sputtering atmospheres to yield reactively sputtered coatings e.g. titanium nitride as well as aluminum oxide. In addition, the film can be controlled by changing the different inert as well as reactive gases.
RECENT BUILDS
