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News from VPE

New Equipment!

Vacuum Process Engineering is pleased to announce the installment of the first of two Vertical Retort Furnaces. These furnaces are being installed to fulfill a contract to braze aluminum parts for Homeland Security equipment. Our second furnace is scheduled to be completed by the end of this year. These vertical retort furnaces are designed to braze aluminum to ceramic, aluminum to aluminum as well as aluminum to other metals.

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Photo Gallery

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Oxygen-Free High Conductivity (OFHC, CDA10100) copper components being prepared as a brazing sub assembly Brazed copper (silver-based filler alloy) electron beam-related assemblies Brazed copper (silver-based filler alloy) electron beam-related assemblies High vacuum brazed pinch-off tubulations sealed in low outgassing bags prior to packaging and shipment.
 
High vacuum brazed pinch-off tubulations sealed in low outgassing bags prior to packaging and shipment. PrecisionBraze processing 65-inch long UHV accelerator for oncology applications. Each assembly is individually inspected for filler alloy flow in hundreds of inches of joints prior to helium leak detection. Titanium plates to be diffusion bonded; after machining the assemblies will be used in underwater robotics applications Water-cooled, RF-biased, electroformed and brazed copper nozzle assembly with 0.004-inch by 0.08-inch long capillary passage
 
Thruster nozzle with highly efficient cooling circuits being prepared for vacuum brazing 400-platelet diffusion bonded cryogenic heat exchanger containing thousands of precisely aligned 0.0090-inch diameter holes. Pure gold filler alloy, quartz lamp heated, vacuum brazed, electrical feedthrough. Overall diameter is about 0.100 inches, outer shell is titanium. Sputter gun cooling plate after brazing of cooling channels, assembly is 78-inches long.
 
Photochemically machined stainless steel microchannel component prior to diffusion bonding a closure layer Platelet stack assembly for a turbine fuel injector. Intricate flow passages in each platelet are diffusion bonded to form complex leak tight manifolds in the final bonded condition. Platelet stack assembly for a turbine fuel injector. Intricate flow passages in each platelet are diffusion bonded to form complex leak tight manifolds in the final bonded condition. Platelet stack assembly for a turbine fuel injector. Intricate flow passages in each platelet are diffusion bonded to form complex leak tight manifolds in the final bonded condition.
 
Platelet stack assembly for a turbine fuel injector. Intricate flow passages in each platelet are diffusion bonded to form complex leak tight manifolds in the final bonded condition. Vacuum and Partial-Pressure Furnace with an all-metal hot zone typically used in production brazing applications Inside view of the furnace Interior of 100-inch long hydrogen/vacuum all-metal shielded furnace
 
Cleanroom-enclosed large capacity furnace for processing assemblies up to about 1700C, note the scale of the technician compared to the furnace opening. Cartesian robot used for filler alloy application to production assemblies. Platelet stack assembly for a turbine fuel injector. Intricate flow passages in each platelet are diffusion bonded to form complex leak tight manifolds in the final bonded condition. Platelet stack assembly for a turbine fuel injector. Intricate flow passages in each platelet are diffusion bonded to form complex leak tight manifolds in the final bonded condition.
 
Induction brazing of molybdenum disk to Kovar One of several systems used for electron beam and sputter deposition of thin films Large diffusion bonding system capable of applying 1,000,000 lb forces to stacked shim, plate and other assemblies at temperatures above 1200C.
 
Custom electronic control system including the capability to independently control up to three ambient process gases. Cryogenically pumped ultra clean tantalum hot zone used for heat treating of refractory metal articles. Dry pumped 60-inch and 30-inch water-cooled vacuum chamber systems used for precision thermal processing of laser, space and semiconductor hardware at temperatures up to about 300C. Pulse-purging processing for National Laboratories is routinely performed Dry pumped 60-inch and 30-inch water-cooled vacuum chamber systems used for precision thermal processing of laser, space and semiconductor hardware at temperatures up to about 300C. Pulse-purging processing for National Laboratories is routinely performed
 
Thin film coated Kapton with soldered electrical conductors, devise is about 2-inches square and has over 40 discrete deposited layers

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