Diffusion Bonding

Typical smaller scale diffusion bonding system with an all metal hot zone and a bellows sealed applied force cylinder.

Diffusion Bonding of shim assemblies, manifolds, microchannel devices, biomedical implants, nozzles, mixers and other precision assemblies assures that intricate features and hermeticity are not compromised. Materials joined include Inconel, titanium, copper, stainless steel, ceramics, aluminum, steel, and other exotics.

• Experience with several process variations ensures that the best method is used for a particular application.
• In-depth know-how combined with design expertise enables the most intricate and challenging devices to be successfully bonded.
• Process is applicable to an array of markets including aerospace, medical, energy, chemical plant fabrications, and electronics and instrumentation industries.
• Preferred joining method for microchannel devices and photo etched laminates, gigahertz waveguides and antennas, corrosion resistant manifolds and heat exchangers.

VPE Capabilities Include:

• Assembly weights to 10,000 pounds
• Size greater than 52 inches in diameter
• Temperatures range to 1300° C
• Design, testing, and technology transfer programs
• Reactive materials bonding
• Applied dynamic loads to 1,000,000lbf
• Modern equipment with partial pressure control of up to three gases.
• Quick cooling Argon-to-water heat exchangers for high production rate processing.
• Cost competitive process

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